Solder paste primarily serves the purposes of conduction, adhesion, and heat dissipation.
In the semiconductor industry, the most common method for applying solder paste is through steel stencil printing. However, as solder pad sizes decrease, a new method of solder paste application, known as point soldering, has emerged.
Point soldering can be categorized into contact and non-contact methods, offering significant advantages for non-standard products and laboratory-scale development and testing.
Process Characteristics
The most common dispensing process for solder paste in the market is contact dispensing. The key points of the process are as follows:
1. Uniformity of solder paste dispensing dots, with the auger valve providing more stable control over the dispensing volume.
2. Precise control of dispensing height, as deviations in height can affect dispensing effectiveness.
Efficiency and consistency are particularly crucial for solder paste dispensing processes.
With years of accumulated experience in solder paste dispensing processes, Axxon has developed mature and reliable products and solutions. In anticipation of future demands, Axxon has increased its research and development efforts, achieving significant breakthroughs in core technological areas such as solder paste jetting systems, closed-loop control of dispensing volume using auger valves, and dispensing height compensation control.
Dispensing Performance
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