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MYC50E

Inline THT Bonding system

The MYSmart MYC50E, built on the MYC50 platform, is an industrial dispensing system specifically engineered for THT bonding applications requiring motorized tilt and rotation functionality. This advanced THT dispensing machine delivers precision performance for demanding THT glue dispensing processes.

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Precision THT Dispensing for Demanding Applications

The MYC50E THT dispensing machine delivers fast and stable operation, making it ideal for high-volume THT bonding applications.

 

Key Features:

·Multi-axis control for complex THT glue dispensing paths

·External feeding system integration for continuous production

·Extended hood design with counterbalances for clean hose management

·High-pressure valve for robust material handling

·Micrometer-level adjustment for ultimate precision

·Needle verification module eliminates manual needle changes

·Electronic scale monitoring ensures consistent THT dispensing quality

 

Enhanced Component Protection

For superior PCB protection, the MYC50E THT bonding system precisely applies single or dual-component materials around THT components or between components and PCB boards.

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Modular Design for Advanced THT Dispensing Solutions

The MYC50E THT dispensing machine features versatile process modules to efficiently handle complex THT bonding applications, ensuring optimal performance for your production needs.

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Specifications

MOTION SYSTEM

MYC50E

Z-axis repeatability

±25um@3σ

X-Y repeatability

±25um@3σ

X-Y acceleration

0.8 g peak

X-Y velocity

800 mm/s peak

Z travel

100mm

Drive system

AC servo motor with precise ball screw

DISPENSING AREA

V-300HP single valve and single lane(XxY)

600x430/490x320(with tilt &rotate)

V-9000H single valve and single lane(XxY)

600x420/400x280(with tilt &rotate)

BOARD HANDLING

Max. top clearance

100 mm

Max. bottom clearance

100 mm

Load capacity

5kg, 10kg(optional)

FACILITIES REQUIREMENTS

System footprint MYC50E(WxDxH)

1,290x1,364x2,120mm (without light tower)

VISION AND LIGHTING

Camera resolution

1.3M pixels

Field of view

14.0 x 11.0 mm

Lighting

Ring Light or Red/Green/White LEDs

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