Underfill is widely used in consumer electronics, including smartphones, tablets, notebooks, and associated Printed Circuit Boards (PCBs) and Flexible Printed Circuits (FPCs). The underfill dispensing process involves applying a low-viscosity fluid beneath components such as Ball Grid Arrays (BGAs), Chip-Scale Packages (CSPs), and Package on Package (POPs) to enhance structural integrity.

Key factors in electronic component underfill include fluid volume control, dispensing path planning, waiting time optimization, and dispensing angle adjustment. Proper parameter settings ensure uniform flow beneath components, eliminating voids and air bubbles while minimizing wet-out areas.

With consumer electronics facing drop, vibration, and extreme temperature conditions, manufacturers require high-precision underfill dispensing equipment to achieve dustproofing, moisture resistance, shock absorption, and thermal stability. As PCB assembly underfill demands increase due to higher component density, low wet-out and precise positioning become essential.

axxon’s Advantages in Underfill Dispensing

·Non-contact piezo jetting system for high-speed, electronically controlled underfill dispensing.

·Patented Calibration Process Jetting (CPJ) technology ensures day-to-day volumetric repeatability.

·In-house valve manufacturing guarantees tight quality control and continuous innovation.

·Advanced features such as tilt/rotate valve mounting, synchronous dispensing, polluted nozzle detection, and integrated AOI defect detection.

axxon’s underfill dispenser delivers precision, reliability, and process optimization, making it an ideal solution for PCB underfill and advanced electronics manufacturing.