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Micro LED

As a new generation of display technology, Micro LED has higher brightness and better luminous efficiency than existing OLED technology, but consumes less power.

The epoxy resin filling process between Micro LED beads can effectively prevent Micro LED beads from falling off and light leakage, and improve the stability and life.

Process Characteristics

The epoxy resin filling process for Micro LED lamp beads is similar to underfill, filling in the gaps between each adjacent LED foot to fix the LED unit and prevent light leakage. The technical difficulty of the process lies in the small size of each adjacent LED unit, with a gap of only 320-430um; and the high weight accuracy requirement of ±5% for each line; meanwhile, there should be no glue on the surface of the lamp bead. This poses great challenges to the stability and accuracy of equipment and valve dispensing, as well as the control of valve scattering points.

The Axxon APJ1500 piezo valve uses a specially designed striker and nozzle to achieve a line width below the 350um limit, while ensuring no scatter. The program command weight control function of Axxon's Au series dispensing software enables closed-loop control of dispensing weight for real-time compensation, ensuring consistency in dispensing weight and effect during continuous mass production. At the same time, advanced equipment calibration compensation technology and visual Mark algorithm ensure that the deviation of each line in the same direction during dispensing is less than 0.1mm. High precision, high speed, and closed-loop weight control greatly improve product yield and reduce costs for customers.

 

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