Atmospheric Argon plasma cleaning system
The Axxon Mycronic MYS10iL plasma system enables atmospheric plasma treatment for large size products that previously could only be that previously could only be cleaned within vacuum plasma chambers.
Electronics assembly and semiconductor markets are rapidly changing with ever increasing reliability and throughput requirements. The Axxon Mycronic MYS series is designed to increase yield and throughput by eliminating the time variables associated with vacuum plasma while still being safe to operate on your sensitive electronics.
Product Features
- Atmospheric pressure argon plasma system
- Inline plasma with 100mm beam width for batch mode production. Compared with traditional
plasma treatment methods, the efficiency has been increased by 2-5X, and cost reduced by
more than 30%
- Safe and friendly. Free of sparks, streamers, particles, UV and heat, ESD safe for sensitive components
- Multiprocessing plasma innovative technology: O2 process removes organic pollutants, H2 process
removes metal oxides and activates the surface of the product
- No particle contamination nor liquid pollutants
MYS10iL is an inline plasma treatment system for various industries: semiconductor, consumable electronics,
SMT, photoelectronic and medical industry.
Specifications
|
Specification |
MYS10iL |
|
Power supply |
AC 200~240V, 4.5 kW, 20A, 50/60 Hz |
|
Air supply |
90psi(6bar) |
|
Dimension |
1000x1500x1550mm |
|
Weight |
885kg |
|
Standard compliance |
CE |
|
Working range |
|
|
Working area of plasma (WxD) |
550~760mm |
|
Contact angle after plasma cleaning (WCA) |
WCA<10° (Wafer) WCA<20° (Plastic) |
|
Plasma cleaning method |
O2 process to remove organic pollutants H2 process to remove metal-oxides |
You may also be interested in
