Atmospheric Argon plasma wafer cleaning system
Electronics assembly and semiconductor markets are rapidly changing with ever increasing reliability and throughput requirements. The Axxon Mycronic MYW10 series is designed to increase yield and throughput by eliminating the time variables associated with vacuum plasma while still being safe to operate on your sensitive electronics.
Product Features
- Atmospheric argon plasma system
- Inline plasma with 100mm beam width for batch mode production. Comparing with traditional plasma method, the efficiency has been increased by 2-5 times, and cost saved by more than 30%
- Safe and friendly. Free of spark, streamers, particles, UV and heat, ESD for sensitive components
- Multiprocessing plasma innovative technology: O2 process removes organic pollutants, H2 process removes metal oxides and activates the surface of the product
- No particle pollution nor surface roughness change in wafer surface
- Compatible for fabrication of wafer and tape frame and support quick switch in between both products
- Class 10 clean room and SEMI standards
Specifications
|
Specification |
MYW10 |
|
Power supply |
AC 380V, 13kW, 20A, 50/60Hz |
|
Air supply |
90psi(6bar) |
|
Dimension |
2000x2800x2200mm |
|
Weight |
2200kg |
|
Standard compliance |
SEMI S2/S6/S8 CE RoHs Reach |
|
Plasma working range |
|
|
Working area of plasma (WxD) |
300x300mm |
|
WCA after cleaning (WCA) |
WCA<10° (Wafer) |
|
Cleaning method |
O2 process to remove organic pollutants H2 process to remove metal- oxides |
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