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MYD50C

Linear motor & clean room high-speed inline dispensing system 

Axxon Mycronic's MYD50S is a Class 1000 cleanroom inline high-speed dispensing system designed for the semiconductor industry. 

 

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Product Features

MYD50C inline high-speed dispensing system for the semiconductor industry.

- Unsurpassed value by combining high-end technology with low total cost of ownership.

- From underfill to solder paste, the MYD series offers many unique jetting technology, offering enhanced flexibility for high volume manufacturing.

- Built-in-AVI capabilities enable automatic inspection of dispense results.

- Class 1000 cleanroom (standard).

- ESD safe.

OPTIONAL CONFIGURATIONS

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KEY COMPONENTS

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SEMICONDUCTOR INDUSTRIES INLINE JETTING APPLICATIONS

• Flip Chip Underfill   • Dome Coating    • Solder Paste Dispensing For MEMS    • No-Flow Underfill    

• Dam&Fill-COB Package    • Glob Top-COB Package   • Solder Paste   • SMA    • Silver Paste Dispensing      

• Tim Dispensing    • Wafer Underfill    • Flux Dispensing

Specifications

Specification

MYD50C

Power supply

AC 200~240V,8A,50/60Hz,

1.8kW, Conveyor heating 1.8kW

Air supply

90psi(6bar)

Dimension

770x1300x1800mm(WxDxH)

Weight

1350kg

Standard compliance

CE,SEMI S2

Dispense area

Max dispensing area (single lane/dual lane)

350x500mm/350x218mm(WxD)

Synchronized dual valve – automatic

adjustment (single lane/dual lane)

315x405mm/315x160mm(WxD)

Asynchronized dual valve (single lane/dual lane)

290x430mm/290x183mm(WxD)

Tilt & rotation (single lane/dual lane)

270x410mm/270x173mm(WxD)

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