Linear motor & clean room high-speed inline dispensing system
Axxon Mycronic's MYD50S is a Class 1000 cleanroom inline high-speed dispensing system designed for the semiconductor industry.
MYD50C inline high-speed dispensing system for the semiconductor industry.
- Unsurpassed value by combining high-end technology with low total cost of ownership.
- From underfill to solder paste, the MYD series offers many unique jetting technology, offering enhanced flexibility for high volume manufacturing.
- Built-in-AVI capabilities enable automatic inspection of dispense results.
- Class 1000 cleanroom (standard).
- ESD safe.
• Flip Chip Underfill • Dome Coating • Solder Paste Dispensing For MEMS • No-Flow Underfill
• Dam&Fill-COB Package • Glob Top-COB Package • Solder Paste • SMA • Silver Paste Dispensing
• Tim Dispensing • Wafer Underfill • Flux Dispensing
Specification |
MYD50C |
Power supply |
AC 200~240V,8A,50/60Hz, 1.8kW, Conveyor heating 1.8kW |
Air supply |
90psi(6bar) |
Dimension |
770x1300x1800mm(WxDxH) |
Weight |
1350kg |
Standard compliance |
CE,SEMI S2 |
Dispense area |
|
Max dispensing area (single lane/dual lane) |
350x500mm/350x218mm(WxD) |
Synchronized dual valve – automatic adjustment (single lane/dual lane) |
315x405mm/315x160mm(WxD) |
Asynchronized dual valve (single lane/dual lane) |
290x430mm/290x183mm(WxD) |
Tilt & rotation (single lane/dual lane) |
270x410mm/270x173mm(WxD) |