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MYC50E inline THT bonding system

MYC50E inline THT bonding system

MYC50E inline THT bonding system

Based on the MYC50 platform, the MYSmart MYC50E is an industrial dispensing system special developed for THT bonding applications that require a motorised tilt and rotation functionality.


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Product features

•  Fast and stable operation

•  Flexible multi-axis control for complex processes

•  Seamless integration of an external feeding system

•  Extended hood for neat hose routing with counterbalances

•  Coupling of a robust and versatile high-pressure valve

•  Micrometer precision fine adjustment

•  Needle verification module eliminates the need for needle change

•  Precision electronic scale module to monitor and maintain process repeatability


In order to better protect these components single or dual component materials can be dispensed between THT components, or in the collar of these components and the PCB board.

tht potting-600x 拷贝.jpg


In order to efficiently implement complex process applications, the MYC50E is designed with a variety of process function module.

MYC50E--KEY-FEATURES-600x-1.jpg

Specifications


MOTION SYSTEM


Z-axis repeatability

±25um@3σ

X-Y repeatability

±25um@3σ

X-Y acceleration

0.8 g peak

X-Y velocity

800 mm/s peak

Z travel

100mm

Drive system

AC servo motor with precise ball screw

DISPENSING AREA


V-300HP single valve and single lane(XxY)

600x430/490x320(with tilt &rotate)

V-9000H single valve and single lane(XxY)

600x420/400x280(with tilt &rotate)

BOARD HANDLING


Max. top clearance

100 mm

Max. bottom clearance

100 mm

Load capacity

5kg, 10kg(optional)

FACILITIES REQUIREMENTS


System footprint MYC50E(WxDxH)

1,290x1,364x2,120mm (without light tower)

VISION AND LIGHTING


Camera resolution

1.3M pixels

Field of view

14.0 x 11.0 mm

Lighting

Ring Light or Red/Green/White LEDs




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