In the semiconductor industry, both in wafer and lead frame production processes, essential steps include Die bond, Wire Bond, Mold, and WOW bond.
The semiconductor industry is divided into the front-end wafer level and the back-end packaging level. In the production processes of wafers and lead frames, critical techniques such as Die bond, Wire Bond, Mold, and WOW bond are indispensable. To ensure the reliability and stability of these processes, plasma surface treatment is essential.
During production processes, organic contaminants and metal oxides on the product surface can lead to low bonding yields between materials, unreliable conductivity, and inadequate adhesion. Plasma surface treatment is commonly employed to address these process challenges.
Process Characteristics
The principle of plasma surface treatment involves ionizing oxygen or hydrogen gas using radio frequency power to generate oxygen ions and hydrogen ions. These ions chemically react with organic contaminants or metal oxides on the product surface, forming gas-state carbon dioxide and water vapor, thereby removing dirt and activating the product surface.
Plasma surface treatment is typically employed to remove organic contaminants from non-metal product surfaces, eliminate metal surface oxides, and activate product surfaces, demanding high requirements for plasma technology applications.
Key points of plasma surface treatment process are as follows:
- Various chemical processes effectively remove organic contaminants and metal oxides from product surfaces, activating the product surface (wafer/glass with WCA < 10°, LEDs/PCB substrate with WCA < 20°).
- Completely safe for products with no ion bombardment, low temperature, low pressure, no ESD, no arc, no splashing, no water ripple, and no UV damage.
- Batch processing ensures production efficiency, can be processed in atmospheric environments, and is easy to maintain.
- Do not contaminate product surfaces with dust particles.
- Do not cause damage or roughness changes to sensitive product surfaces.
- Different platforms are selected for efficient and flexible processing based on different product applications.
- Compatible with production of products of different sizes and ensures compatibility through rapid switching.
Plasma surface treatment is applied in industries such as semiconductor, automotive electronics, consumer electronics, and LEDs. Innovative plasma technology offers significant opportunities to replace traditional plasma technologies. Moreover, equipment capacity and stability are crucial for production enterprises. Axxon has accumulated years of application experience in these industries, possessing mature and stable high-speed, high-precision motion platforms. These platforms can be flexibly combined with different plasma heads and modules to meet the diverse application needs of different customers.
You may also be interested in
