The application principle of plasma surface treatment is to ionize oxygen with a radiofrequency power supply to form oxygen ions, which then react with organic dirt on the surface of the product to form carbon dioxide and water gas that are pumped away, ultimately achieving the goal of removing organic dirt and activating the product.

The main points of plasma surface treatment process are as follows：

1. A variety of chemical processes effectively remove organic dirt and metal oxides on the product surface, activate the product surface (wafer/glass WCA<10°, LEDs/PCB substrate WCA<20°)

2. 100% safe and friendly to the product, no ion bombardment, low temperature, low pressure, no ESD, no arc, no splash, no water ripple, no UV damage

3. Online batch processing to ensure production efficiency, can be processed in atmospheric environment and easy to maintain

4. No dust particles contaminate the product surfaceIt

5. Will not cause damage and roughness change on the surface of sensitive products.

6. Choose different platforms according to different product applications to ensure high efficiency and flexibility

7. Compatible with different sizes of products and fast switching to ensure compatibility

Plasma surface treatment technology is used in semiconductor, automotive electronics, consumer electronics, LED and other industries. Innovative plasma technology has great opportunities to replace traditional plasma technology, and equipment productivity and stability are extremely important to manufacturers Axxon has accumulated years of application experience in these industries, and has a mature and stable high-speed and high-precision motion platform. It can flexibly match different platforms and plasma heads, and select different modules to meet the application needs of different customers.