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Chip Cooling

Chip Cooling

Excessive heat generated by high speed chips must be transferred heat sinks via thermal interface materials.

The increased density of chips has led to higher power consumption per unit area necessitating more effective heat dissipation solutions.

Due to the presence of micro gaps between the heat sink and the chip, thermal dissipation efficiency is lost.  Applying Thermal Interface Materials (TIM) to the heat sink will fill the microgaps and enhance heat transfer allowing high speed products to run a maximum speed for longer.

Process Characteristic

Thermal Interface Materials (TIM) play a key role in our lives.  TIM's allow our favorite devices to run at high speeds by transfering heat from the high power chips to heat disipation units.  All products from phones to watches to laptops to cars utilize TIM's within the final package.  Enhanced heat dissipation is acheived by integrating fillers that are highly abrasive.  These abrasive fillers create new demands on dispense technology.  Pumps must have an exceptional wear resistance and be able to handle the high viscosity that TIMS's are made to.  Traditional dispense technologies utilize auger feed or piston type systems.  These systems are limited by the voume of fluid that can be dispensed, repeatability and life of wetted parts.  Volumetric technologies such as Progressive Cavity Pumps (PCP) have been developed that can dispense any volume at exceptional levels of repeatability and have adjustable flow rates.  Bulk feeding of TIM's also poses a challenge due to the high viscosity and the length of feedlines from the reservoir to the pumping system.


Volumetric repeatability is important in TIM deposition due to the cost of fluid.  There is a fine line between too much and too little TIM.  Too much and it is wasted cost and too little and full thermal transfer is not achieved.  Axxon Mycronic and developed dispense pumps, feeding system and even tools to track and confirm the amount of TIM used.  Pre and post weight inspection, 2D Fluid inspection and even 3D laser scans are available features to enhance your TIM processes.


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