Electronic Components / Pin Encapsulation
With increasing component density of PCBs comes a proliferation of smaller components. During solder paste printing, insufficient solder paste deposition on these smaller components can lead to weaker adhesion, rendering the components prone to connection failure. Critical components can be additionally secured by applying Surface Mount Adhesive (SMA) below the device, or in some cases by staking the component on the side.
Furthermore, large, heavy and irregular shaped components or those with pin encapsulation, such as integrated circuits (ICs) and be prone to connection issues in a high shock or thermally cycled environments. Applying SMA as a staking/edge bonding process will add additional bonding strength to the component. Products with double sided SMT will also require SMA to be dispensed below devices to avoid detechment during a wave solder or double sided reflow process.
Process Characteristics
The encapsulation process is primarily employed in the consumer electronics industry, including sectors such as smartphones, tablets, notebooks, and associated assembly of PCBs and FPC boards.
For components undergoing full encapsulation or glob top the cured results must be bubble free. In the case of wire bonded encapsulation processes, wires of the components must be encased in encapsulation for stability. Moreover, certain areas are not permitted to come into contact with the encapsulation, and the resultant encapsulation must be within certain size tolerances, maybe to fit within a package.
The trend towards heightened integration of electronic components necessitates precise control over fluid volume and fluid placement, representing a significant industry development trend.
With years of accumulated experience in the application of encapsulation processes, Axxon Mycronic has developed mature and reliable products and solutions. Future demands drive us to intensify our research and development efforts towards higher levels of integrated control and self monitored repeatability. Features such as closed-loop weight control and integrated fluid AOI systems offer addditional process checks for reliable processes.
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