The purpose of Dome Coating dispensing process is to increase the reliability of components, prevent detachment, collision, and damage during component encapsulation, primarily applied in the semiconductor industry for leadframe, chips, and wire bonding dispensing processes.

In the Dome Coating dispensing process, control over adhesive volume, adhesive height, dispensing trajectory, and dispensing range are crucial process parameters to ensure effective dispensing. In the Dome Coating process, adhesive height and consistency are particularly important.

The high integration of chips leads to reduced dispensing space, and compact packaging spaces. Therefore, controlling smaller single points and ensuring the stability of adhesive dispensing are industry trends.

Axxon has accumulated years of experience in Dome Coating process applications, providing mature and reliable products and solutions. In response to future demands, Axxon has increased its investment in research and development, offering flexible integration of various types of dispensing valves, optional simultaneous input and output, three-section conveyor tracks, automatic loading and unloading systems to meet the diverse needs of different customers.