Protecting the internal structure of chips, moisture-proof and shock-proof.
With the development of the microelectronics industry towards lightweight, thin, small, increased I/O count, and diversified functionality, flip chip packaging technology has emerged, with underfilling being a core process.
The chip underfill process fills the gap between the chip and the substrate with adhesive to protect and reinforce solder balls or leads, commonly used in flip chip packaging.
Process characteristics
Chip-level underfilling typically employs non-contact dispensing, requiring strict control over dispense points and dispensing volume.
Key points of chip-level underfilling process are as following:
1. There are many components around the perimeter, so overflow width needs to be strictly controlled.
2. The surface of BGA chips is smooth, requiring high accuracy in dispense points, and the surface must be free of stains.
3. The internal solder balls of BGA are unevenly arranged, making it prone to voids during underfilling.
4. Heating at the bottom of the machine affects the viscosity of the adhesive, thereby affecting the dispensed volume.
Efficiency and consistency are particularly important for chip-level underfilling processes.
Chip-level underfilling processes are applied in the semiconductor industry, where equipment capacity and stability are crucial for production companies. Axxon has accumulated years of application experience in the semiconductor industry, possessing mature and stable high-speed, high-precision motion platforms that can flexibly integrate various types of dispensing valves, optional tilting and rotating mechanisms, three-stage conveyors, and valve cooling systems to meet the diverse needs of different customers.
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