Fixing the Chip to the Carrier and Providing Conductivity
The Integrated Circuit (IC) is bonded to the carrier using an adhesive, serving the dual purpose of fixation and conductivity. Typically, the adhesive consists of metallic particles, flux agents, binders, and diluents, with silver paste being the most common adhesive used.
Process Characteristics
Silver paste is used in various products such as crystal oscillators, hard drives, chips, LEDs, headphones, microphones, and more.
The key points of the process for connecting ICs to substrates using silver paste include:
1. Uniform coating of silver paste.
2. Stability of dispensing from the valve.
Efficiency and consistency are particularly important in the process of dispensing silver paste.
Silver paste is widely used in the semiconductor industry, where equipment capacity and stability are crucial for production enterprises. Axxon offers flexible configurations with various types of dispensing valves and options for three-stage conveyor tracks to meet the diverse needs of different customers. In response to future demands, Axxon has increased research and development efforts, achieving significant breakthroughs in core technologies such as closed-loop control of dispensing volume and high-wear auger feeding systems.
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