Linear motor & clean room high-speed inline dispensing system
Axxon Mycronic's MYD50S is a Class 1000 cleanroom inline high-speed dispensing system designed for the semiconductor industry.
MYD50C inline high-speed dispensing system for semiconductor industry.
- Unsurpassed value by combining high-end technology with low total cost of ownership.
- From underfill to solder paste the MYD series offers many unique jetting technology, offering enhanced flexibility for high volume manufacturing.
- Built-in-AVI capabilities enable automatic inspection of dispense results.
- Class 1000 cleanroom (standard).
- ESD safe.
• Flip Chip Underfill • Dome Coating • Solder Paste Dispensing For MEMS • No-Flow Underfill
• Dam&Fill-COB Package • Glob Top-COB Package • Solder Paste • SMA • Silver Paste Dispensing
• Tim Dispensing • Wafer Underfill • Flux Dispensing
Specification | MYD50C |
Power supply | AC 200~240V,8A,50/60Hz, 1.8kW, Conveyor heating 1.8kW |
Air supply | 90psi(6bar) |
Dimension | 770x1300x1800mm(WxDxH) |
Weight | 1350kg |
Standard compliance | CE,SEMI S2 |
Dispense area | |
Max dispensing area (single lane/dual lane) | 350x500mm/350x218mm(WxD) |
Synchronized dual valve – automatic adjustment (single lane/dual lane) | 315x405mm/315x160mm(WxD) |
Asynchronized dual valve (single lane/dual lane) | 290x430mm/290x183mm(WxD) |
Tilt & rotation (single lane/dual lane) | 270x410mm/270x173mm(WxD) |