3 stage heating high-speed inline dispensing system
MYD50S inline high-speed dispensing system is specifically designed for the precision dispensing applications for the chip packaging in the semiconductor industry. Thanks to the Micron resolution grating scale and closed loop control in the linear motor motion system and user-friendly GUI, this reliable and highly cost effective MYD50s provides extremely accurate and fast dispensing within the work area up to 350x500mm. With the accumulated technical expertise and global service network, Axxon could provide the customers complete solutions for R&D, manufacturing and production as well as innovation.
Product features
MYD50S inline high-speed dispensing system for semiconductor industry.
- Unsurpassed value by combining high-end technology with low total cost of ownership.
- From underfill to solder paste the MYD series offers many unique jetting technology, offering enhanced flexibility for high volume manufacturing.
- Built-in-AVI capabilities enable automatic inspection of dispense results.
- Class 10000 cleanroom (standard).
- ESD safe.
OPTIONAL CONFIGURATIONS
• Dam&Fill-COB Package • Glob Top-COB Package • Solder Paste • SMA • Silver Paste Dispensing
• Tim Dispensing • Wafer Underfill • Flux Dispensing
Specifications
Specification | MYD50S |
Power supply | AC 200~240V,8A,50/60Hz, 1.8kW, Conveyor heating 1.8kW |
Air supply | 90psi(6bar) |
Dimension | 1050x1300x1530mm(WxDxH) |
Weight | 1370kg |
Standard compliance | CE,SEMI S2 |
| Dispense area | |
Max dispensing area (single lane/dual lane) | 350x500mm/350x205mm(WxD） |
Synchronized dual valve – automatic adjustment (single lane/dual lane) | 315x405mm/315x157mm(WxD） |
Asynchronized dual valve (single lane/dual lane) | 290x430mm/290x170mm(WxD） |
Tilt & rotation (single lane/dual lane) | 270x410mm/270x160mm(WxD） |
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